| Sept 27 |
Infinite
Power Solutions Granted Three Key United States Patents |
| Sept 20 |
D2S
Unveils Industry's First Mask-Wafer Double Simulation Platform |
| Sept 12 |
eBeam
Initiative Members Present Collaborative Results At SPIE/BACUS Photomask
Symposium 2011 |
| Sept 7 |
EV
Group Launches New Flagship Model In Its Gemini® FB Family of
Fusion Wafer Bonding Systems to Enhance Throughput and Automation
Performance |
| Aug 31 |
Synopsys
and Achronix Announce Multi-Year Renewal of Synthesis Partnership |
| Aug 8 |
Synopsys
Introduces Dolby TrueHD Decoder and Dolby Digital 5.1 Creator Encoder
for DesignWare ARC Sound Audio Processors |
| July 27 |
EV
Group Breaks Ground for Headquarters Expansion Due to Increased Customer
Demand |
| July 26 |
Synopsys'
LightTools Delivers Leading-Edge Illumination Analysis |
| July 20 |
Ricoh
Adopts Synopsys' Processor Designer to Accelerate Custom DSP Design |
| July 19 |
Synopsys
Introduces Virtualizer Next-Generation Virtual Prototyping Solution
|
| July 18 |
Renesas
Electronics Achieves 4X Faster Performance with Synopsys' HAPS®
FPGA-Based Prototyping Solution |
| July 12 |
EV
Group Highlights Technology Firsts, Key Advancements at SEMICON West
2011 |
| July 12 |
Gigaphoton
Confirms Its Debris Mitigation Technology Using Magnetic Fields for
EUV Light Sources |
| July 11 |
EV
Group Unveils Industry's First Wafer Bonding System for 450-mm Silicon-On-Insulator
Semiconductor Wafers |
| July 11 |
Non-Visual
Defect Inspection Continues to Gain Momentum in Semiconductor Industry
as Qcept Technologies Announces New Orders and Mid-Year Update |
| July 11 |
Synopsys
and GLOBALFOUNDRIES Collaborate to Deliver Interoperable Process Design
Kits (iPDKs) |
| July 11 |
Synopsys
Announces Critical Milestone in 20-nm Design Enablement Collaboration
with Samsung Electronics |
| July 11 |
Synopsys
Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation
Support |
| July 6 |
EV
Group Joins Georgia Tech 3D Systems Packaging Research Center |
| June 28 |
EV
Group Gemini Wafer Bonder to be Implemented at Quebec's State-Of-The-Art
MiQro Innovation Collaborative Centre |
| June 21 |
EV
Group Adds In-Line Metrology Capability to Wafer Bonding Systems to
Support High-Volume 3D-IC and TSV Manufacturing |
| June 20 |
Qcept
Technologies Establishes Korea Subsidiary and Names Semiconductor
Industry Veteran Richard Hong President of Asia-Pacific |
| June 16 |
MCA
Public Relations to Host BrightSpots 450-mm Forum During SEMICON West
2011 |
| June 13 |
Synopsys
Custom Design Solution Enables Moortec Semiconductor to Tape Out High-performance
Analog IP |
| June 8 |
Synopsys
Honors Shrenik Mehta with Eleventh Annual Tenzing Norgay Interoperability
Achievement Award |
| June 6 |
ARM
and Synopsys Sign Multi-Year EDA Tools and ARM® Cortex™-A15
Access Agreements |
| June 2 |
Synopsys
and TSMC Collaborate to Deliver Custom Design Solution for 28nm Analog/Mixed-Signal
Reference Flow 2.0 |
| June 2 |
Synopsys
Collaborates with STMicroelectronics to Help Achieve Critical Milestone
in 20-nm Design |
| June 1 |
Innovative
SEMI High Tech U Program Introduces Greater Phoenix Area High School
StudentsTo World Of High Tech Careers |
| May 26 |
Synopsys
Delivers 28-nm Design Solutions and Advanced System-Level Capabilities
for TSMC Reference Flow 12.0 |
| May 23 |
Rohde
& Schwarz and Synopsys Form Strategic Collaboration for LTE/LTE-Advanced
Design Acceleration |
| May 16 |
Leading
Semiconductor Equipment Supplier Adopts NVD Inspection Solution from
Qcept Technologies for Wafer Cleaning and Surface Prep Applications |
| May 12 |
Synopsys'
DesignWare SATA 6Gb/s IP Solutions Receive SATA-IO Certification |
| May 11 |
Ultratech
Announces HB-LED Asia Technology Center in Taiwan |
| May 11 |
MEDIA
Advisory: Key Display Week 2011 Information |
| May 11 |
Synopsys
DesignWare ARC Sound IP Solution First to Support the Dynamic Resolution
Adaptation Audio Standard |
| May 10 |
Infinite
Power Solutions Joins DASH7 Alliance |
| May 5 |
Synopsys’
DesignWare SuperSpeed USB 3.0 xHCI Host Controller IP Receives USB-IF
Certification |
| May 4 |
SID
& IMS Research Announce Final Agenda for eBook & Table Market
Evolution Conference |
| May 3 |
Final
Agenda Unveiled for SID DisplaySearch Business Conference, to be Held
During Display Week 2011 In Los Angeles |
| Apr 28 |
Society
for Information Display and Cowen and Company to Host Seventh Annual
Investors Conference During Display Week 2011 |
| Apr 26 |
Latest
Innovations in Synopsys IC Compiler Deliver up to 40 Percent Power
Reduction at HiSilicon |
| Apr 19 |
CEA-Leti
to Implement Multiple EV Group Systems on its New 300-mm Fab Line
Dedicated to 3D Integration |
| Apr 19 |
Synopsys
Design Compiler Graphical Cuts Design Time at Exar |
| Apr 18 |
Synopsys
Advances Mixed-Signal Verification with New CustomExplorer Ultra |
| Apr 11 |
EV
Group Recognized as Leader in Nanoimprint Lithography with Frost &
Sullivan 2010 Technology Innovation Award |
| Apr 11 |
SID
Names 2011 Honors and Awards Recipients for Outstanding Contributions
to Furthering the Display Industry |
| Mar 31 |
Fairchild
Semiconductor Achieves First-Pass Silicon Success with DesignWare
USB 2.0 nanoPHY IP |
| Mar 30 |
Synopsys
Announces Availability of DesignWare PHY and Embedded Memory IP for
TSMC Advanced 28-nanometer Technologies |
| Mar 29 |
D2S
Taps Semiconductor EDA Veteran to Serve as Vice President of Engineering |
| Mar 28 |
Synopsys
Unveils DC Explorer for Early RTL Exploration |
| Mar 23 |
SAVE-THE-DATE:
Display Week 2011 Returns To Los Angeles, Calif., MAY 15-20, 2011 |
| Mar 23 |
Freescale
Licenses Synopsys' DesignWare IP Portfolio to Accelerate SoC Designs |
| Mar 22 |
Wilocity
Tapes-Out Multi-Gigabit Wireless Communication SoC Using Synopsys
DesignWare IP |
| Mar 21 |
Leading
Semiconductor Manufacturers in Asia Adopt NVD Inspection Solution
from Qcept Technologies for 3X-nm Memory and Logic Production |
| Mar 21 |
Synopsys'
Next-Generation DesignWare Data Converter IP Delivers 50 Percent Lower
Power with Smaller Area |
| Mar 15 |
EV
Group Advances SOI Leadership and Presence in China With First Order
from SOI Supplier Shenyang Silicon Technology |
| Mar 8 |
Synopsys
Announces FPGA Synthesis Support for Xilinx's Newest ISE Design Suite
13 |
| Mar 7 |
Yokogawa
Achieves 5X Faster Programmable Logic Controller Performance with
Synopsys' Processor Designer |
| Mar 2 |
Synopsys
and Xilinx Collaborate on the Industry's First Methodology Manual
for FPGA-Based Prototyping of SoC Designs |
| Mar 1 |
D2S
and Nuflare Partner to Reduce Write Times for Complex 22-nm Photomasks |
| Mar 1 |
Synopsys
Introduces Proteus LRC for Lithography Verification |
| Feb 28 |
Gigaphoton
Demonstrates the Highest Efficiency in Creating EUV Light |
| Feb 28 |
Synopsys
DesignWare IP First to Support Final Release of PCI Express 3.0 Specification |
| Feb 23 |
Infinite
Power Solutions Appoints Bryan Holley as Executive VP of Worldwide
Sales And Marketing |
| Feb 22 |
EV
Group Expands Portfolio of Products to Address Fast-Growing HB-LED
Market with Launch of EVG620HBL Mask Alignment System |
| Feb 22 |
Synopsys
Announces Immediate Availability of Silicon-Proven DesignWare Data
Converter IP in SMIC 65-nm LL Process Technology |
| Feb 10 |
Synopsys
and Varian Collaborate on Process Models for Advanced Logic and Memory
Technologies |
| Feb 7 |
Synopsys
Announces New Technology for Optimizing Multicore Systems |
| Feb 3 |
Synopsys
Invites Cadence Incisive and Mentor Graphics Questa Users to the Verification
FastForward Program |
| Feb 1 |
Synopsys
Collaborates with Industry Consortium on Solutions to Model Latest
28-nm Parasitic Effects |
| Jan 31 |
Latest
Release of Synopsys IC Compiler Delivers Faster Design Closure |
| Jan 31 |
Synopsys
Galaxy Implementation Platform Addresses Gigascale Design |
| Jan 28 |
MEDIA
ADVISORY/ALERT: Synopsys To Showcase Designware Ip, Fpga Design, Fpga-Based
Prototyping And Hspice Solutions At Designcon 2011 |
| Jan 27 |
Ultratech
Receives 12th Safety Award For Employee Health and Safety Policies
|
| Jan 26 |
Synopsys'
DesignWare DDR PHY Compiler Eases Integration of Memory Interface
IP |
| Jan 19 |
Infinite
Power Solutions Celebrated as One of Colorado's Companies to Watch |
| Jan 12 |
Synopsys
Announces Android Operating System Support for DesignWare ARC Processor
Cores |
| Jan 11 |
Ultratech
Introduces Latest Generation Laser Annealing System for 28-nm Node
And Beyond |
| Jan 6 |
Synopsys'
New DesignWare Sonic Focus IP Solutions Deliver Exceptional Sound
through Standard Speakers |
| Dec 21 |
Ultratech
introduces new dual-beam laser spike anneal system |
| Dec 7 |
Synopsys
Expands DesignWare MIPI IP Portfolio with DSI Host Controller |
| Dec 6 |
Synopsys
Receives IEEE Standards Association Corporate Award for 2010 |
| Dec 6 |
Ultratech
opens advanced manufacturing facility in Singapore |
| Dec 1 |
IPS
Names Former Segway Executive as New President and CEO |
| Dec 1 |
New
Wafer-Level Microlens Molding Process from EV Group Extends Manufacturing
Roadmap for CMOS Image Sensors |
| Nov 23 |
Infinite
Power Solutions Receives Multiple Industry Awards for THINERGY Technology
|
| Nov 18 |
Synopsys'
New LightTools Enhances Lighting Design Capabilities for the
Development of Luminaires |
| Nov 17 |
Synopsys
Expands EDA's Largest Users Group to Include Conferences in Ottawa
and Austin |
| Nov 17 |
Ultratech
announces the opening of its Singapore international operations |
| Nov 16 |
IPS
Lands Design Win at MicroStrain |
| Nov 11 |
Synopsys
NanoTime Enables Full Chip Transistor Level Timing Analysis on Cavium
Networks OCTEON II Internet Application Processor |
| Nov 8 |
Perpetually
powered DSP applications made possible with Thinergy |
| Nov 4 |
San
Francisco State University Receives Charles Babbage Grant from Synopsys |
| Nov 2 |
EV
Group realizes continued growth for fiscal year 2010 |
| Nov 2 |
Synopsys'
New DesignWare STAR ECC IP Helps Reduce Embedded Memory Transient
Errors |
| Nov 1 |
Synopsys
Expands Synthesis-Based Test Technology to Increase Designer Productivity |
| Oct 28 |
Carl
Zeiss and Synopsys Collaborate on In-Die Registration Metrology for
Photomask Manufacturing |
| Oct 28 |
Synopsys'
Silicon-Proven DesignWare HDMI 1.4a Tx Controller and PHY IP Receive
HDMI Certification |
| Oct 26 |
Synopsys
Power-Aware Test Speeds Time to Volume Production at Realtek |
| Oct 25 |
GSA
and the HIS Initiative Jointly Publish Results of Survey on Hardware
Intrinsic Security in the Semiconductor Industry |
| Oct 25 |
Himax
Standardizes on Synopsys Implementation, Verification and IP Solutions
for Video SoC Products |
| Oct 22 |
Ultratech
Receives Significant Multi-System, Follow-On Laser Spike Anneal Order
From Large Foundry in Asia |
| Oct 21 |
Infinite
Power Solutions' CEO, Ray Johnson, named Colorado Cleantech Entrepreneur
Of The Year by Colorado Cleantech Industry Association |
| Oct 21 |
Synopsys
Awarded TSMC's "Interface IP Partner of the Year" |
| Oct 19 |
EV
Group wins order for UV-NIL/hot embossing systems from Fraunhofer
Research Institution for Electronic Nano Systems |
| Oct 19 |
EVG
unveils EVG520l3 next-generation wafer bonding system with key cost-of-ownership
advantages for advanced packaging and MEMS applications |
| Oct 18 |
Advisory/Synopsys’
23rd EDA Interoperability Forum to Feature System-Level Design Tool
Interoperability Focus |
| Oct 18 |
EV
Group's gemini® wafer bonder selected by MEMS pioneer Sensonor
for high-volume production of thermal imaging devices |
| Oct 18 |
STMicroelectronics
Joins the IPL Alliance as the First Semiconductor Board Member |
| Oct 13 |
EV
Group breaks through resolution barrier with introduction of soft
UV nanoimprint lithography technology |
| Oct 13 |
Synopsys
CustomSim Selected by GSI Technology for High-Speed SRAM Simulation |
| Oct 12 |
100
Tapeouts Underscore Rapid and Broad Acceptance of Synopsys' In-Design
Physical Verification |
| Sept 27 |
Synopsys
Enhances Synplify FPGA Synthesis Software with Up to 4X Faster Runtime
and New Team-Design Capabilities |
| Sept 23 |
EV
Group strengthens presence in Middle East with order win from King
Abdullah University of Science and Technology |
| Sept 21 |
Ultratech
Receives Multi-System Order for Laser Spike Annealing Systems from
Major Logic Foundry for 40-nm Production Ramp |
| Sept 20 |
New
Synopsys HSPICE Precision Parallel Technology Delivers Up to 7X Speed-up
for Analog/Mixed-Signal Designs |
| Sept 14 |
Synopsys
Reduces IP Integration Risk with Extensive SATA-IO Interoperability
Testing |
| Sept 10 |
MEDIA
ADVISORY/ALERT: Synopsys Showcases DesignWare IP Solutions for PCI
Express, USB and SATA at Intel Developer Forum 2010 |
| Sept 8 |
Synopsys
DFTMAX Compression Cuts Pin-Limited Test Cost by 95 Percent at Silicon
Image |
| Sept 7 |
eBeam
Initiative Members Jointly Present Collaborative Results at SPIE/BACUS
Symposium 2010 |
| Sept 1 |
MCA
Public Relations to host BrightSpots Lithography Forum during Bacus
2010 |
| Aug 25 |
MEDIA
ALERT: MCA to host online tech forum on HB-LEDs in October |
| Aug 24 |
Synopsys
Announces Immediate Availability of DesignWare MIPI M-PHY IP in 40-nm
Process Technology |
| Aug 17 |
IPS
Raises $20 Million in Series C Financing |
| Aug 5 |
Synopsys
Custom Design Tools Enable Creative Chips to Achieve First-pass Silicon
Success |
| Aug 3 |
Synopsys
and GLOBALFOUNDRIES to Develop DesignWare Interface PHY IP for 28-Nanometer
Technologies |
| July 13 |
EV
Group capitalizes on MEMS market leadership, further diversifies business
with key 3D IC AND LED manufacturing technology advances |
| July 12 |
EV
Group introduces industry's first fully automated wafer bonding system
for high-brightness light emitting diode (HB-LED) manufacturing |
| July 8 |
EV
Group and the Institute of Microelectronics in Singapore partner to
advance through-silicon via process development for 3D IC integration |
| July 6 |
EV
Group introduces new EVG610 mask and bond aligner optimized for greater
cost and process flexibility |
| July 6 |
Qcept
Technologies introduces next-generation NVD inspection solution for
patterned wafers |
| June 16 |
FormFactor,
Inc. Announces Cost Reduction Measures |
| June 16 |
Synopsys
Honors IEEE-ISTO with Tenth Annual Tenzing Norgay Interoperability
Achievement Award |
| June 14 |
|
| June 14 |
PrimeTime
2010 Scales Timing Analysis Beyond 500 Million Instances |
| June 14 |
Synopsys
Delivers Optimized Lynx Design System for Common Platform 32/28-nm
Technology |
| June 14 |
Synopsys
Unveils Galaxy Characterization Solution for Standard Cells, Complex
Macros and Memories |
| June 14 |
Synopsys
Unveils StarRC Custom 3D Extraction Delivering 20X Speedup |
| June 10 |
Samsung
Electronics Achieves First-Pass 32nm Silicon Success Using Synopsys
Galaxy Implementation Platform |
| June 9 |
Synopsys
Delivers Comprehensive Custom Design Solution for TSMC Analog/Mixed-Signal
Reference Flow 1.0 |
| June 8 |
Synopsys
Delivers Comprehensive Design Enablement for TSMC 28-nm Process Technology
with Reference Flow 11.0 |
| June 7 |
Synopsys
and IEEE-ISTO Launch an Industry Wide Technical Advisory Board to
Evolve Interconnect Modeling Standard |
| June 3 |
Synopsys
Announces Synphony HLS Support for Xilinx Virtex-6 FPGAs |
| June 3 |
Synopsys
Press Publishes The Ten Commandments for Effective Standards |
| May 31 |
Fraunhofer
IZM-ASSID Selects EV Group Temporary Bonding And Debonding Equipment
For Developing Processes For High-Volume Manufacturing Of 3D ICs |
| May 27 |
Private
Meetings with Brazilian Representatives Booked Solid at SID Display
Week |
| May 19 |
Global
Technology Leaders Convene In Seattle To Showcase The Hottest Electronic
Display Technology Set To Hit The Market At Display Week 2010 |
| May 19 |
MCA
High-Tech Public Relations Announces New Organizational Structure
|
| May 13 |
Synopsys'
IC Compiler Widely Deployed at MediaTek |
| May 10 |
Sony
Electronics' Stan Glasgow To Explore Future Of Entertainment In 3D
During Sid DisplaySearch Business Conference Held At Display Week
2010 |
| May 5 |
Latest
Synopsys IC Compiler Release Delivers More Than 2X Speed-Up, Enhanced
In-Design Technology and Production Support for 28/32nm |
| May 5 |
Society
for Information Display and Cowen and Company to host 6th Annual Investors
Conference during Display Week 2010 |
| May 5 |
Synopsys
Unveils Ethernet Controller IP with New Audio Video Bridging Feature |
| Apr 29 |
Premier
TV brand to keynote Society for Information Display and IMS conferences'
TV Market Focus Conference |
| Apr 28 |
New
Synopsys Universal DDR Controllers Improve Performance and Reduce
Cost of Embedded DRAM Interfaces |
| Apr 28 |
SID
applauds 2010 honors and awards recipients for outstanding contributions
to furthering the display industry |
| Apr 21 |
Synopsys
Announces Support for Actel's New SmartFusion Intelligent Mixed Signal
FPGAs |
| Apr 19 |
Synopsys
Introduces the HAPS-60 Series of Rapid Prototyping Systems |
| Apr 14 |
Leading
Industry Experts to Discuss TV, Lighting and Touch Market Outlooks
at SID Market Focus Conference Series During Display Week 2010 |
| Apr 14 |
Synopsys
Expands IP OEM Partner Program with Two New Members |
| Apr 13 |
D2S
and Jeol Partner to Reduce Write Times for Advanced Photomask Production |
| Apr 13 |
eBeam
Initiative Members Publish Collaborative Results at Photomask Japan
2010 |
| Apr 13 |
Qcept
Technologies Secures $10.4 Million in Funding |
| Apr 12 |
Synopsys
Recognizes Technical Excellence at 20th Annual SNUG San Jose Conference |
| Apr 7 |
Display
Week 2010 Business Conference to Spotlight E-Paper and Flexible Display
Markets |
| Apr 7 |
Synopsys
DesignWare DDR multiPHY IP Supports Six DDR Standards in a Single
PHY |
| Mar 31 |
Synopsys’
DesignWare SuperSpeed USB 3.0 IP Receives USB-IF Certification |
| Mar 30 |
Infinite
Power Solutions Achieves ISO 9001:2008 Certification |
| Mar 30 |
Wafer-Level
Camera Manufacturer, Nemotek Technologie, Selects EV Group Wafer Bonding
and UV Nanoimprint Lithography Systems for Capacity Ramp |
| Mar 29 |
Design
Compiler 2010 Doubles Productivity of Synthesis and Place and Route |
| Mar 22 |
The
Society for Information Display and DisplaySearch Partner Again on
Display Week 2010 Business Conference |
| Mar 15 |
Society
for Information Display and IMS Conferences Debut First-Ever Market
Focus Conference Series During Display Week 2010 |
| Mar 10 |
Society
for Information Display to Serve Up Exciting Slate of Sessions at
Display Week 2010 in Seattle |
| Feb 23 |
D2S
Redefines Mask Rules for the 22-Nm and Smaller Technology Nodes |
| Feb 23 |
eBeam
Initiative Membership Grows to 27 |
| Feb 23 |
Ultratech
Receives Order from Taiwan's Largest Led Chip Manufacturer |
| Feb 22 |
Molecular
Imprints Introduces First Nanopatterning Solution for Hard Disk Drive
Volume Manufacturing of Patterned Media for the Terabit ERA |
| Feb 16 |
Molecular
Imprints Upgrades Imprio® 250 System To Imprio® 300 At Toshiba |
| Feb 9 |
NILCom
Consortium to Highlight Latest Developments at Nano Tech 2010 |
| Feb 9 |
Yamaha
Tapes Out Their Latest Graphics LSI Chip with Synopsys Design Compiler
Graphical |
| Feb 9 |
Ultratech
Introduces Sapphire 100 Lithography System for HBLED Manufacturing
|
| Feb 5 |
APAC
IC Adopts Synopsys Galaxy Custom Designer Solution to Meet Growing
Analog/Mixed-Signal IC Design Service Demand |
| Feb 4 |
Infinite
Power Solutions' Thinergy™ Micro-Energy Cell Wins Another Industry
Honor |
| Feb 4 |
Ultratech
Receives Follow-on, Multi-System Order for Laser Spike Annealing Systems
from Major Logic Foundry |
| Feb 1 |
Aeroflex
Realizes 60x Performance Improvement Using Synopsys CustomSim Solution |
| Jan 27 |
MEDIA
ADVISORY/ALERT: Synopsys Showcases Silicon-Proven DesignWare IP Solutions
for SuperSpeed USB 3.0, DDR and PCI Express at DesignCon 2010 |
| Jan 25 |
Synopsys
Expands DesignWare IP Portfolio with MIPI IP Solutions |
| Jan 25 |
Synopsys
Launches DesignWare HDMI 1.4 Tx/Rx Controller and PHY IP Solutions
for 40-nm Process Technologies |
| Jan 20 |
NXP
and Intrinsic-ID Collaborate to Raise the Bar in Chip Security |
| Jan 13 |
Synopsys
Announces DesignWare Protocol Analyzer for Verification of SuperSpeed
USB 3.0-based Designs |
| Jan 12 |
Infinite
Power Solutions and Arrow Electronics Sign Global Distribution Agreement |
| Jan 11 |
Synopsys
Introduces Industry's First SystemC TLM-2.0 SuperSpeed USB 3.0 Models |
| Jan 11 |
Synopsys
Speeds Timing Signoff by 2X With Latest Multicore Technology |
| Dec 29 |
FormFactor
Ships 125th DRAM Wafer Probe Card with Advanced TRE™ Technology |
| Dec 8 |
Loongson
Achieves First-Pass Silicon Success on High-Performance CPU with Synopsys
CustomSim Circuit Simulation Solution |
| Dec 7 |
MEDIA
ADVISORY/ALERT: Synopsys And Marines from the 6th Engineer Support
Battalion to Hold a Toys for Tots Holiday Drop-Off Event |
| Dec 7 |
Synopsys
Chosen as Primary EDA Partner by Hisilicon |
| Nov 24 |
Synopsys
Expands DesignWare Data Converter IP Portfolio with 40-nm Solutions |
| Nov 17 |
Infinite
Power Solutions Unleashes the World's Most Powerful Thin-Film, Solid-State,
Single-Cell Battery on the Market |
| Nov 16 |
Digital
Imaging Systems Achieves First-pass Silicon Success with Synopsys
Galaxy Custom Designer |
| Nov 10 |
FormFactor
Qualifies Industry's First One-Touchdown 300-mm Wafer Probe Solution
for DRAM Sort Test |
| Nov 9 |
eBeam
Initiative Introduces Design For e-Beam Methodology Guidelines and
Training Courses |
| Nov 5 |
Synopsys
Chosen by Realtek as Its Primary EDA Partner |
| Nov 3 |
Synopsys
TetraMAX ATPG Cuts Test Development Schedule at Arrow Electronics |
| Nov 2 |
Advisory/Synopsys
EDA Interoperability Forum to Feature Subodh Bapat Keynote on Green
Computing |
| Nov 2 |
Infinite
Power Solutions Launches Infinergy Micro Power Module Product Family |
| Nov 2 |
Synopsys
Extends DFTMAX Compression to Reduce the Cost of Pin-Limited Test |
| Oct 28 |
FormFactor
Unveils Next-Generation 300-mm Full-wafer Test Solution for NAND Flash |
| Oct 28 |
NVIDIA
Adopts Synopsys Yield Explorer to Reduce Time to Volume |
| Oct 28 |
Synopsys
Announces 40th DesignWare Audio Codec IP |
| Oct 26 |
Freescale
and Synopsys Announce Multi-year Strategic Collaboration Agreement
to Increase Verification Productivity |
| Oct 20 |
Synopsys
Enables Optimized High-Performance Energy-Efficient ARM Processor-based
Designs |
| Oct 19 |
MEDIA
ADVISORY/ALERT: Special Technical Session and Breakfast - Vertically
Optimized 32/28nm Solution for Mobile SoC Design at ARM TechCon3 Conference |
| Oct 12 |
D2S
to Speak at The International Conference On Computer-Aided Design |
| Oct 12 |
Synopsys
Introduces Synphony High Level Synthesis |
| Oct 7 |
Korea
PV Market Expected to Reach 200MW by 2012 |
| Oct 7 |
Synopsys
DesignWare USB 2.0 and Ethernet IP Enables First-Pass Silicon Success
for STMicroelectronics |
| Oct 6 |
EV
Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image
Sensor Manufacturing Facilities in Asia |
| Oct 6 |
Synopsys'
Sentaurus TCAD Used to Simulate Solar Cell Performance Characteristics
at NREL |
| Oct 5 |
FormFactor
Acquires Technology Assets of Electroglas, Inc |
| Oct 5 |
Synopsys
Recognizes Technical Excellence at SNUG Boston Conference |
| Sept 30 |
Common
Platform Alliance Qualifies Synopsys IC Validator for 32-nm Design
Rule Checking |
| Sept 29 |
EV
Group's Gemini Wafer Bonder Selected by Leading Korean Research Center
and Foundry Service Provider RFID/USN For 3d MEMS Manufacturing |
| Sept 28 |
Thinergy
Micro Energy Cells from Infinite Power Solutions Win VDC Research
Group's "Best In Show" at Embedded Systems Conference |
| Sept 22 |
MEDIA
ADVISORY/ALERT: Synopsys First IP Vendor to Demonstrate SuperSpeed
USB 3.0 Host, Hub and Device IP in a Single Demonstration |
| Sept 21 |
Synopsys
Unveils StarRC Custom Parasitic Extraction Solution |
| Sept 15 |
Sunplus
Selects Synopsys as Its Primary EDA Partner |
| Sept 14 |
TSMC
Selects Synopsys HSIM Simulator for Sub-40nm Memory IP Characterization |
| Sept 9 |
Indian
Institute of Technology Kharagpur Receives Charles Babbage Grant from
Synopsys |
| Sept 9 |
Synopsys
First to Announce DDR3 IP with Support for 2133 Mbps Data Rates and
1.35V DDR3L |
| Sept 2 |
TFT-LCD
Panel Makers Invest In LCD Fabs in China |
| Sept 1 |
Innovative
Non-Profit, FeelGood, is Saving the World One Grilled Cheese at a
Time |
| Sept 1 |
WANTED:
Innovative Solutions to World's Water Crisis - Reward: $70,000 |
| Aug 25 |
Renesas
Technology Selects Synopsys Proteus OPC for 45-nm Node Production |
| Aug 21 |
University
of Southampton receives Charles Babbage Grant from Synopsys |
| Aug 13 |
Synopsys
Delivers Comprehensive HDMI IP Solution for 90-nm to 40-nm Process
Technologies |
| Aug 11 |
FormFactor
Reaches Reliability Milestone with Takumi™ Parametric Probe Card
|
| Aug 3 |
Rockchip
Collaborates with Synopsys and Chartered to Achieve First-Pass Silicon
Success |
| July 29 |
Synopsys
Honors Accellera and The SPIRIT Consortium with Ninth Annual Tenzing
Norgay Interoperability Achievement Award |
| July 28 |
Teradici
Chooses Synopsys as its Primary EDA Partner |
| July 28 |
Synopsys
Introduces Galaxy 2009 with 2x Faster Throughput |
| July 27 |
ARM,
Chartered, IBM, Samsung, and Synopsys Collaborate to Deliver Vertically
Optimized Solution for 32/28nm Mobile SoC Designs |
| July 24 |
Synopsys
Introduces Galaxy Constraint Analyzer to Improve Designer Productivity |
| July 22 |
Synopsys
Galaxy Implementation Platform Supports TSMC 28-Nanometer Process
Technology with Reference Flow 10.0 |
| July 21 |
Synopsys
and TSMC Jointly Develop Interoperable Process Design Kit (iPDK) and
Interoperable Ecosystem |
| July 20 |
MCA
Public Relations Reveals Discussions From BrightSpotsSM
3D IC Panel Event |
| July 20 |
Synopsys
Introduces IC Compiler In-Design Rail Analysis to Accelerate Design
Closure |
| July 20 |
Synopsys’
New DesignWare IP Slashes Power in Datapath Circuits |
| July 16 |
EV
Group to Collaborate with Applied Materials on Thin Wafer Bonding
Technology For 3D IC Development |
| July 16 |
Achronix
Deploys Synopsys IC Validator and IC Compiler for Next-Generation
FPGA Design |
| July 14 |
EV
Group Witnesses Rise in Order Intake and Increase in Demand for Services |
| July 14 |
NetLogic
Microsystems Selects Synopsys as its Primary EDA Partner |
| July 13 |
EV
Group Unveils Next-Generation UV-Nanoimprint Lithography (UV-NIL)
Step and Repeat System--The EVG770 Gen II NIL Stepper |
| July 9 |
EV
Group Secures Order for 300-mm Wafer Bonder from SEMATECH's 3D Interconnect
Program at UAlbany NanoCollege |
| July 1 |
Synopsys
MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform |
| June 29 |
Aquantia
Deploys Synopsys IC Validator and IC Compiler for 40nm Quad 10GBASE-T
Design |
| June 24 |
Achronix
Selects Synopsys as its Leading EDA Partner |
| June 23 |
SMIC
and Synopsys Announce the Availability of Reference Flow 4.0 |
| June 23 |
Synopsys
and TSMC Deliver Accurate Lithography Verification for 28nm Designs |
| June 17 |
Synopsys
and Actel Renew OEM Relationship for FPGA Design Software |
| June 16 |
Flextech
Alliance Completes Contract With HP To Develop Unique Self-Aligned
Imprint Lithography (SAIL) Technology |
| June 16 |
Infinite
Power Solutions' Infinergy™ Micro Power Module Wins Two Major
Industry Awards |
| June 15 |
Synopsys
Continues Galaxy Custom Designer Momentum with 2009.06 Release |
| June 10 |
Flextech
Alliance Announces Dates for 2010 Flexible Electronics And Displays
Conference |
| June 10 |
Jet
and Flash™ Imprint Lithography (J-FIL™) Continues to Gain
Momentum as Molecular Imprints Announces Progress at Key Industry
Events |
| June 9 |
EV
Group Completes Wafer Bonding Portfolio With The Launch of its New
Generation EVG501 R&D System |
| June 9 |
Infinite
Power Solutions Launches its Thinergy™ Micro-Energy Cell Product
Family |
| June 9 |
Synopsys
IC Compiler with Zroute Technology Achieves Successful Tapeout for
Infineon Automotive Microcontroller |
| June 9 |
TSMC
Selects Synopsys Galaxy Implementation Platform for Integrated Sign-off
Flow |
| June 8 |
Synopsys
Enables System Design Interoperability with System-Level Catalyst
Program |
| June 8 |
MCA
Public Relations to Host BrightSpotsSM Forum on 3D IC Technology |
