| Apr 29 |
Premier
TV brand to keynote Society for Information Display and IMS conferences'
TV Market Focus Conference |
| Apr 28 |
New
Synopsys Universal DDR Controllers Improve Performance and Reduce
Cost of Embedded DRAM Interfaces |
| Apr 28 |
SID
applauds 2010 honors and awards recipients for outstanding contributions
to furthering the display industry |
| Apr 21 |
Synopsys
Announces Support for Actel's New SmartFusion Intelligent Mixed Signal
FPGAs |
| Apr 19 |
Synopsys
Introduces the HAPS-60 Series of Rapid Prototyping Systems |
| Apr 14 |
Leading
Industry Experts to Discuss TV, Lighting and Touch Market Outlooks
at SID Market Focus Conference Series During Display Week 2010 |
| Apr 14 |
Synopsys
Expands IP OEM Partner Program with Two New Members |
| Apr 13 |
D2S
and Jeol Partner to Reduce Write Times for Advanced Photomask Production |
| Apr 13 |
eBeam
Initiative Members Publish Collaborative Results at Photomask Japan
2010 |
| Apr 13 |
Qcept
Technologies Secures $10.4 Million in Funding |
| Apr 12 |
Synopsys
Recognizes Technical Excellence at 20th Annual SNUG San Jose Conference |
| Apr 7 |
Display
Week 2010 Business Conference to Spotlight E-Paper and Flexible Display
Markets |
| Apr 7 |
Synopsys
DesignWare DDR multiPHY IP Supports Six DDR Standards in a Single
PHY |
| Mar 31 |
Synopsys’
DesignWare SuperSpeed USB 3.0 IP Receives USB-IF Certification |
| Mar 30 |
Infinite
Power Solutions Achieves ISO 9001:2008 Certification |
| Mar 30 |
Wafer-Level
Camera Manufacturer, Nemotek Technologie, Selects EV Group Wafer Bonding
and UV Nanoimprint Lithography Systems for Capacity Ramp |
| Mar 29 |
Design
Compiler 2010 Doubles Productivity of Synthesis and Place and Route |
| Mar 22 |
The
Society for Information Display and DisplaySearch Partner Again on
Display Week 2010 Business Conference |
| Mar 15 |
Society
for Information Display and IMS Conferences Debut First-Ever Market
Focus Conference Series During Display Week 2010 |
| Mar 10 |
Society
for Information Display to Serve Up Exciting Slate of Sessions at
Display Week 2010 in Seattle |
| Feb 23 |
D2S
Redefines Mask Rules for the 22-Nm and Smaller Technology Nodes |
| Feb 23 |
eBeam
Initiative Membership Grows to 27 |
| Feb 23 |
Ultratech
Receives Order from Taiwan's Largest Led Chip Manufacturer |
| Feb 22 |
Molecular
Imprints Introduces First Nanopatterning Solution for Hard Disk Drive
Volume Manufacturing of Patterned Media for the Terabit ERA |
| Feb 16 |
Molecular
Imprints Upgrades Imprio® 250 System To Imprio® 300 At Toshiba |
| Feb 9 |
NILCom
Consortium to Highlight Latest Developments at Nano Tech 2010 |
| Feb 9 |
Yamaha
Tapes Out Their Latest Graphics LSI Chip with Synopsys Design Compiler
Graphical |
| Feb 9 |
Ultratech
Introduces Sapphire 100 Lithography System for HBLED Manufacturing
|
| Feb 5 |
APAC
IC Adopts Synopsys Galaxy Custom Designer Solution to Meet Growing
Analog/Mixed-Signal IC Design Service Demand |
| Feb 4 |
Infinite
Power Solutions' Thinergy™ Micro-Energy Cell Wins Another Industry
Honor |
| Feb 4 |
Ultratech
Receives Follow-on, Multi-System Order for Laser Spike Annealing Systems
from Major Logic Foundry |
| Feb 1 |
Aeroflex
Realizes 60x Performance Improvement Using Synopsys CustomSim Solution |
| Jan 27 |
MEDIA
ADVISORY/ALERT: Synopsys Showcases Silicon-Proven DesignWare IP Solutions
for SuperSpeed USB 3.0, DDR and PCI Express at DesignCon 2010 |
| Jan 25 |
Synopsys
Expands DesignWare IP Portfolio with MIPI IP Solutions |
| Jan 25 |
Synopsys
Launches DesignWare HDMI 1.4 Tx/Rx Controller and PHY IP Solutions
for 40-nm Process Technologies |
| Jan 20 |
NXP
and Intrinsic-ID Collaborate to Raise the Bar in Chip Security |
| Jan 13 |
Synopsys
Announces DesignWare Protocol Analyzer for Verification of SuperSpeed
USB 3.0-based Designs |
| Jan 12 |
Infinite
Power Solutions and Arrow Electronics Sign Global Distribution Agreement |
| Jan 11 |
Synopsys
Introduces Industry's First SystemC TLM-2.0 SuperSpeed USB 3.0 Models |
| Jan 11 |
Synopsys
Speeds Timing Signoff by 2X With Latest Multicore Technology |
| Dec 29 |
FormFactor
Ships 125th DRAM Wafer Probe Card with Advanced TRE™ Technology |
| Dec 8 |
Loongson
Achieves First-Pass Silicon Success on High-Performance CPU with Synopsys
CustomSim Circuit Simulation Solution |
| Dec 7 |
MEDIA
ADVISORY/ALERT: Synopsys And Marines from the 6th Engineer Support
Battalion to Hold a Toys for Tots Holiday Drop-Off Event |
| Dec 7 |
Synopsys
Chosen as Primary EDA Partner by Hisilicon |
| Nov 24 |
Synopsys
Expands DesignWare Data Converter IP Portfolio with 40-nm Solutions |
| Nov 17 |
Infinite
Power Solutions Unleashes the World's Most Powerful Thin-Film, Solid-State,
Single-Cell Battery on the Market |
| Nov 16 |
Digital
Imaging Systems Achieves First-pass Silicon Success with Synopsys
Galaxy Custom Designer |
| Nov 10 |
FormFactor
Qualifies Industry's First One-Touchdown 300-mm Wafer Probe Solution
for DRAM Sort Test |
| Nov 9 |
eBeam
Initiative Introduces Design For e-Beam Methodology Guidelines and
Training Courses |
| Nov 5 |
Synopsys
Chosen by Realtek as Its Primary EDA Partner |
| Nov 3 |
Synopsys
TetraMAX ATPG Cuts Test Development Schedule at Arrow Electronics |
| Nov 2 |
Advisory/Synopsys
EDA Interoperability Forum to Feature Subodh Bapat Keynote on Green
Computing |
| Nov 2 |
Infinite
Power Solutions Launches Infinergy Micro Power Module Product Family |
| Nov 2 |
Synopsys
Extends DFTMAX Compression to Reduce the Cost of Pin-Limited Test |
| Oct 28 |
FormFactor
Unveils Next-Generation 300-mm Full-wafer Test Solution for NAND Flash |
| Oct 28 |
NVIDIA
Adopts Synopsys Yield Explorer to Reduce Time to Volume |
| Oct 28 |
Synopsys
Announces 40th DesignWare Audio Codec IP |
| Oct 26 |
Freescale
and Synopsys Announce Multi-year Strategic Collaboration Agreement
to Increase Verification Productivity |
| Oct 20 |
Synopsys
Enables Optimized High-Performance Energy-Efficient ARM Processor-based
Designs |
| Oct 19 |
MEDIA
ADVISORY/ALERT: Special Technical Session and Breakfast - Vertically
Optimized 32/28nm Solution for Mobile SoC Design at ARM TechCon3 Conference |
| Oct 12 |
D2S
to Speak at The International Conference On Computer-Aided Design |
| Oct 12 |
Synopsys
Introduces Synphony High Level Synthesis |
| Oct 7 |
Korea
PV Market Expected to Reach 200MW by 2012 |
| Oct 7 |
Synopsys
DesignWare USB 2.0 and Ethernet IP Enables First-Pass Silicon Success
for STMicroelectronics |
| Oct 6 |
EV
Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image
Sensor Manufacturing Facilities in Asia |
| Oct 6 |
Synopsys'
Sentaurus TCAD Used to Simulate Solar Cell Performance Characteristics
at NREL |
| Oct 5 |
FormFactor
Acquires Technology Assets of Electroglas, Inc |
| Oct 5 |
Synopsys
Recognizes Technical Excellence at SNUG Boston Conference |
| Sept 30 |
Common
Platform Alliance Qualifies Synopsys IC Validator for 32-nm Design
Rule Checking |
| Sept 29 |
EV
Group's Gemini Wafer Bonder Selected by Leading Korean Research Center
and Foundry Service Provider RFID/USN For 3d MEMS Manufacturing |
| Sept 28 |
Thinergy
Micro Energy Cells from Infinite Power Solutions Win VDC Research
Group's "Best In Show" at Embedded Systems Conference |
| Sept 22 |
MEDIA
ADVISORY/ALERT: Synopsys First IP Vendor to Demonstrate SuperSpeed
USB 3.0 Host, Hub and Device IP in a Single Demonstration |
| Sept 21 |
Synopsys
Unveils StarRC Custom Parasitic Extraction Solution |
| Sept 15 |
Sunplus
Selects Synopsys as Its Primary EDA Partner |
| Sept 14 |
TSMC
Selects Synopsys HSIM Simulator for Sub-40nm Memory IP Characterization |
| Sept 9 |
Indian
Institute of Technology Kharagpur Receives Charles Babbage Grant from
Synopsys |
| Sept 9 |
Synopsys
First to Announce DDR3 IP with Support for 2133 Mbps Data Rates and
1.35V DDR3L |
| Sept 2 |
TFT-LCD
Panel Makers Invest In LCD Fabs in China |
| Sept 1 |
Innovative
Non-Profit, FeelGood, is Saving the World One Grilled Cheese at a
Time |
| Sept 1 |
WANTED:
Innovative Solutions to World's Water Crisis - Reward: $70,000 |
| Aug 25 |
Renesas
Technology Selects Synopsys Proteus OPC for 45-nm Node Production |
| Aug 21 |
University
of Southampton receives Charles Babbage Grant from Synopsys |
| Aug 13 |
Synopsys
Delivers Comprehensive HDMI IP Solution for 90-nm to 40-nm Process
Technologies |
| Aug 11 |
FormFactor
Reaches Reliability Milestone with Takumi™ Parametric Probe Card
|
| Aug 3 |
Rockchip
Collaborates with Synopsys and Chartered to Achieve First-Pass Silicon
Success |
| July 29 |
Synopsys
Honors Accellera and The SPIRIT Consortium with Ninth Annual Tenzing
Norgay Interoperability Achievement Award |
| July 28 |
Teradici
Chooses Synopsys as its Primary EDA Partner |
| July 28 |
Synopsys
Introduces Galaxy 2009 with 2x Faster Throughput |
| July 27 |
ARM,
Chartered, IBM, Samsung, and Synopsys Collaborate to Deliver Vertically
Optimized Solution for 32/28nm Mobile SoC Designs |
| July 24 |
Synopsys
Introduces Galaxy Constraint Analyzer to Improve Designer Productivity |
| July 22 |
Synopsys
Galaxy Implementation Platform Supports TSMC 28-Nanometer Process
Technology with Reference Flow 10.0 |
| July 21 |
Synopsys
and TSMC Jointly Develop Interoperable Process Design Kit (iPDK) and
Interoperable Ecosystem |
| July 20 |
MCA
Public Relations Reveals Discussions From BrightSpotsSM
3D IC Panel Event |
| July 20 |
Synopsys
Introduces IC Compiler In-Design Rail Analysis to Accelerate Design
Closure |
| July 20 |
Synopsys’
New DesignWare IP Slashes Power in Datapath Circuits |
| July 16 |
EV
Group to Collaborate with Applied Materials on Thin Wafer Bonding
Technology For 3D IC Development |
| July 16 |
Achronix
Deploys Synopsys IC Validator and IC Compiler for Next-Generation
FPGA Design |
| July 14 |
EV
Group Witnesses Rise in Order Intake and Increase in Demand for Services |
| July 14 |
NetLogic
Microsystems Selects Synopsys as its Primary EDA Partner |
| July 13 |
EV
Group Unveils Next-Generation UV-Nanoimprint Lithography (UV-NIL)
Step and Repeat System--The EVG770 Gen II NIL Stepper |
| July 9 |
EV
Group Secures Order for 300-mm Wafer Bonder from SEMATECH's 3D Interconnect
Program at UAlbany NanoCollege |
| July 1 |
Synopsys
MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform |
| June 29 |
Aquantia
Deploys Synopsys IC Validator and IC Compiler for 40nm Quad 10GBASE-T
Design |
| June 24 |
Achronix
Selects Synopsys as its Leading EDA Partner |
| June 23 |
SMIC
and Synopsys Announce the Availability of Reference Flow 4.0 |
| June 23 |
Synopsys
and TSMC Deliver Accurate Lithography Verification for 28nm Designs |
| June 17 |
Synopsys
and Actel Renew OEM Relationship for FPGA Design Software |
| June 16 |
Flextech
Alliance Completes Contract With HP To Develop Unique Self-Aligned
Imprint Lithography (SAIL) Technology |
| June 16 |
Infinite
Power Solutions' Infinergy™ Micro Power Module Wins Two Major
Industry Awards |
| June 15 |
Synopsys
Continues Galaxy Custom Designer Momentum with 2009.06 Release |
| June 10 |
Flextech
Alliance Announces Dates for 2010 Flexible Electronics And Displays
Conference |
| June 10 |
Jet
and Flash™ Imprint Lithography (J-FIL™) Continues to Gain
Momentum as Molecular Imprints Announces Progress at Key Industry
Events |
| June 9 |
EV
Group Completes Wafer Bonding Portfolio With The Launch of its New
Generation EVG501 R&D System |
| June 9 |
Infinite
Power Solutions Launches its Thinergy™ Micro-Energy Cell Product
Family |
| June 9 |
Synopsys
IC Compiler with Zroute Technology Achieves Successful Tapeout for
Infineon Automotive Microcontroller |
| June 9 |
TSMC
Selects Synopsys Galaxy Implementation Platform for Integrated Sign-off
Flow |
| June 8 |
Synopsys
Enables System Design Interoperability with System-Level Catalyst
Program |
| June 8 |
MCA
Public Relations to Host BrightSpotsSM Forum on 3D IC Technology |
