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3D IC Forum
Videos
Part I: Defining 3D at the Packaging Level and the Circuit Level
Part II: Wire Bonding vs. Through-silicon Vias (TSVs) and Design Tools for 3D
Part III: Thin-wafer Handling - Temporary Bonding/Debonding
Part IV: 3D vs. Traditional Scaling
Part V: Heat Generation Issues with Chip Stacking and Thermal Dissipation Requirements
Podcasts
Full Panel Discussion
BrightSpots Sit Downs with:
Paul Lindner, Executive Technology Director, EV Group
Sitaram Arkalgud, Director, 3D Interconnect Program, SEMATECH
Ricardo Borges, Senior Product Marketing Manager, Silicon Engineering Group, Synopsys, Inc.
Robert Patti, Chief Technology Officer, Tezzaron Semiconductor Corp.
Jean-Christophe Eloy, Founder and Chief Executive Officer, Yole Développement
Photos
MCA BrightSpots 3D IC Panel
MCA's Press and Analyst Cocktail Event
